Surface Mount Technology

Pick and Place Machine:

We have a fully automatic Siemens T72B pick and place machine capable of placing up to 4000 components per hour on a placement area 270 x 240mm. The machine is fully automatic, all placement information being fully controlled by computer which once programmed ensures repeatability batch after batch. Screen printed pcbs are placed on the conveyor system which feeds the pcb onto the placement area and then passes the completed assembly out of the machine ready for reflow. The T72B has a high feeder capacity for different component types and includes an automatic testing option which checks all passive components and diodes before placement thus ensuring a high pass rate of assembled products in subsequent electronic testing. An integrated adhesive dispenser enables the use of adhesive application and placement processes to be carried out simultaneously within a single program sequence. A high precision positioning system enable the T72B to have a placement accuracy of +/- 0.08mm meeting the requirements of all components styles down to 0603 size for passives and 0.025 I/C leaded packages. We believe this machine is the best machine in its class enabling us to offer to our customers precision, reliability and quality.

Reflow Oven:
A Quantum 3 Zone Infra-Red Reflow Oven is used to give a fully controllable temperature profile on reflow. This ensures that the board and components receive as little stress as possible yet still achieve an excellent soldered product.

Screen Printer:
The DEK 245 screen printer is a high performance multipurpose screen printer with a 245 x 203mm print area and a fully automatic print cycle.

Rework Station:
We have a Smart Rework Centre for our rework station. This has hot air desoldering using a wide range of special heads. Magnification of X 20 or X 30 is used to position the heads ensuring accurate repositioning of the IC if rework is required.